ESCS provides solutions to the factors that lead to the growth of Tin Whiskers

Tin whiskers present a unique challenge to the electronics industry. There have been numbers of electronics failures in the market caused by tin whiskers since 1940s. After 2000, as a result of the global transition to lead-free electronics, the majority of the electronic component manufacturers are now using pure tin or tin-rich alloys for terminal and lead finishes. The increased used of tin based lead-free finishes and materials, focused concern and research on tin whiskers particular for long life and mission critical applications, such as space, aviation, and implantable medical devices. The Center of Advanced Life Cycle Engineering at the University of Maryland in collaboration with The Institute of Scientific and Industrial Research (ISIR) at Osaka University is conducting the Fourth International Symposium on Tin Whiskers.
  What is a tin whisker? ESCS has the awnser. A tin whisker is a conductive tin crystal, which can spontaneously grow from tin based lead-free finished surfaces even at room temperature, often in a needle-like form. Oxidation in humid atmosphere, corrosion, intermetallic formation, stress under thermal cycling, external pressure in fine pitch connectors and electromigration have been shown to promote whisker formation.

Electronic Supply Chain Solutions urges those affected by tin wiskers to atten this symposium which will cover case histories, theories of tin whisker growth, experiments and results, risk evaluation methods and risk mitigation strategies. It is important to understand the current state of knowledge on the growth, risk and mitigation strategies, so you can develop effective qualification and mitigation procedures for your products. To learn more visit http://www.calce.umd.edu/tin-whiskers/symposia.htm Excerps taken from the Center for Advanced Life Cycle Engineering (CALCE) &The Institute of Scientific and Industrial Research (ISIR), Osaka University